Rapid thermal processing of electronic materials

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This volume contains the proceedings of one of the earliest major international symposia devoted entirely to rapid thermal processing (RTP) for semiconductor manufacturing. during the mid-1980s, rtp emerged as a promising alternative to conventional furnace processing because it allowed wafers to be heated to very high temperatures within seconds and cooled rapidly, reducing unwanted diffusion and enabling tighter control of device fabrication. the proceedings document the transition of rtp from a laboratory technique into a practical manufacturing technology for silicon and compound-semiconductor devices. the volume covers equipment design, temperature measurement, dopant activation, oxidation, silicidation, defect control, polysilicon processing, and applications to advanced vlsi and iii-v semiconductor devices.

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